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Surface Mount Chip LEDs Technical Data
HSMB-C190/C170/ C110/C150
Features
* * * * * Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30C to +85C * Right Angle Package Available * SiC Blue Color * Available in 8 mm tape on 7" (178 mm) Diameter Reels
Description
These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0
Applications
* * * * * Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator
x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium.
Device Selection Guide
Footprint (mm) 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] 3.20 x 1.60
Note: 1. Right-angle package.
SiC Blue HSMB-C170 HSMB-C190 HSMB-C110 HSMB-C150
Parts Per Reel 4000 4000 3000 3000
2
Package Dimensions
LED DIE CATHODE MARK
CATHODE MARK LED DIE
1.25 (0.049)
0.8 (0.031) 0.4 (0.016)
1.6 (0.063 )
0.62 (0.024) 2.0 (0.079 )
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
DIFFUSED EPOXY 0.3 (0.012) PC BOARD
1.4 (0.055)
POLARITY
0.8 (0.031) 0.3 (0.012)
0.8 (0.031) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006)
0.4 0.15 (0.016 0.006)
0.4 0.15 (0.016 0.006)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMB-C190
LED DIE CATHODE MARK
HSMB-C170
1.0 (0.039)
LED DIE
CATHODE MARK
2.6 (0.102 )
1.6 (0.063)
3.2 (0.126 ) POLARITY
0.8 (0.031)
CLEAR EPOXY 1.5 (0.059) PC BOARD 0.5 (0.020) 1.6 (0.063 )
3.2 (0.126 )
DIFFUSED EPOXY 0.6 (0.024)
2.0 (0.079)
POLARITY
1.1 (0.043) PC BOARD 0.5 (0.020)
1.0 (0.039)
0.50 0.2 (0.020 0.008)
0.50 0.2 (0.020 0.008)
1.0 (0.039)
SOLDERING TERMINAL
CATHODE LINE
SOLDERING TERMINAL
HSMB-C110
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMB-C150
3
Absolute Maximum Ratings at TA=25C
Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 A) Maximum LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMB-C190/C170/C110/C150 Units 20 mA 100 mA 92 mW 5 V 95 C -30 to +85 C -40 to +85 C See IR soldering profile (Figure 7)
Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25C. 2. Pulse condition of 1/10 duty and 0.1 msec. width.
Optical Characteristics at TA=25C
Part No. HSMBC190/C170/C150 HSMB-C110 Color SiC Blue SiC Blue Luminous Intensity[1] Iv (mcd) @ 20 mA Min. Typ. 1.60 6.0 1.60 6.5 Peak Wavelength peak (nm) Typ. 428 428 Dominant Wavelength d (nm) Typ. 466 466 Viewing Angle 21/2 (degrees)[2] Typ. 170 130
Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA=25C
Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.8 4.6 3.8 4.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 Thermal Resistance RJ-P (C/W) Typ. 300 300 Capacitance C (pF) @ VF = 0 V, f = 1 MHz Typ. 67 67
Part No. HSMB-C190/C170/C150 HSMB-C110
4
100
IF - FORWARD CURRENT - mA RELATIVE INTENSITY - %
100
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.2 1.0 0.8 0.6 0.4 0.2 0
80
10
60
40
1
20
0 380
480
580
680
0.1
3.0
3.2
3.4
3.6
3.8
4.0
0
5
10
15
20
25
WAVELENGTH - nm
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
Figure 1. Relative Intensity vs. Wavelength.
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Relative Luminous Intensity vs. Forward Current.
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25
100 90
RELATIVE INTENSITY - %
20
80 70 60 50 40 30 20 10
15
10
5
0
0
20
40
60
80
100
0 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
TA - AMBIENT TEMPERATURE - C
ANGLE
Figure 4. Maximum Forward Current vs. Ambient Temperature.
RELATIVE INTENSITY - %
100 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMB-C110.
5
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, and HSMB-C150.
10 SEC. MAX.
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. MAX.
1.2 (0.047)
1.2 (0.047)
1.2 (0.047)
0.9 (0.035)
Figure 7. Recommended Reflow Soldering Profile.
Figure 8. Recommended Soldering Pattern for HSMB-C170.
5.0 (0.200) 0.9 (0.035) 0.9 (0.035)
0.8 (0.031)
1.5 (0.059) 0.2 (0.008)
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
1.5 (0.059)
2.0 (0.079)
1.5 (0.059)
Figure 9. Recommended Soldering Pattern for HSMB-C190.
Figure 10. Recommended Soldering Pattern for HSMB-C110.
Note: 1. All dimensions in millimeters (inches).
6
USER FEED DIRECTION
1.5 (0.059)
CATHODE SIDE
1.5 (0.059)
2.0 (0.079)
1.5 (0.059)
PRINTED LABEL
Figure 11. Recommended Soldering Pattern for HSMB-C150.
Figure 12. Reeling Orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.)
O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 13. Reel Dimensions.
Note: 1. All dimensions in millimeters (inches).
7
4.00 (0.157) 1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002)
1.75 (0.069)
3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
CARRIER TAPE USER FEED DIRECTION COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.85 (0.073) 1.85 (0.073) 2.40 (0.094) 3.35 (0.132) 3.75 (0.148) 1.00 (0.039) 1.00 (0.039) 1.60 (0.063) 1.85 (0.073) 2.10 (0.083) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.30 (0.051)
HSMx-C110 POSITION IN CARRIER TAPE
Figure 14. Tape Dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 15. Tape Leader and Trailer Dimensions.
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours.
www.semiconductor.agilent.com Data subject to change. Copyright (c) 2000 Agilent Technologies, Inc. Obsoletes 5980-1186E 5980-2427E (9/00)

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